● Compatible with various specifications of PCB board soldering processes● Unique pressurized heating structure, double-layer Swiss nickel chromium wire+wind wheel+accelerator heating method, low energy consumption, high efficiency● Microcirculation hot a
●Hongxiang Intelligent's new 8-zone nitrogen reflow soldering (double-track split type) can fully adapt to high-speed production and high-precision semiconductor packaging processes, achieving a qualitative leap in production capacity●High-precision tempe
â— Suitable for high-end products with rigorous requirements.â— Available in 8 zones, 10 zones, and 12 zones for selection.â— Features 3 independent cooling zones (standard) with up and down airflow.â— Combination chain and mesh belt conveyors (standa
◠Suitable for high-speed production and precision semiconductor packaging.◠A+ hot air reflux system architecture with excellent thermal performance.◠Sealed furnace design maintains a greenhouse surface temperature of +5°C.◠Controllable nitrog
â—Patent heating technology with independent circulation air design.â—Suitable for BGA and CSP component welding.â—High thermal efficiency and energy-saving.â—Fast heating speed.
â— Customizable Split Type: No lifting or wall dismantling required.â— Equipped with Built-In Three-Channel Furnace Temperature Testing Program and Real-Time Temperature Curves.â— High Precision Transmission Support Structure with durable guide rail ch